By Suryadevara Babu
Advances in Chemical Mechanical Planarization (CMP) provides the most recent details on a mainstream technique that's serious for high-volume, high-yield semiconductor production, or even extra in order machine dimensions proceed to cut back. The expertise has grown to surround the elimination and planarization of a number of steel and dielectric fabrics and layers either on the gadget and the metallization degrees, utilizing diverse instruments and parameters, requiring advancements within the keep watch over of topography and defects.
This vital ebook deals a scientific assessment of basics and advances within the quarter. half One covers CMP of dielectric and steel motion pictures, with chapters concentrating on using specific strategies and procedures, and on CMP of specific a variety of fabrics, together with extremely low-k fabrics and high-mobility channel fabrics, and finishing with a bankruptcy reviewing the environmental affects of CMP methods.
Part addresses consumables and method keep an eye on for more suitable CMP, and contains chapters at the practise and characterization of slurry, diamond disc pad conditioning, using FTIR spectroscopy for characterization of floor strategies, and ways for defection characterization, mitigation, and reduction.
- Considers suggestions and approaches for CMP of dielectric and steel films
- Includes chapters dedicated to CMP for specific materials
- Addresses consumables and procedure regulate for more advantageous CMP
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