Download Arbitrary Modeling of TSVs for 3D Integrated Circuits by Khaled Salah,Yehea Ismail,Alaa El-Rouby PDF

By Khaled Salah,Yehea Ismail,Alaa El-Rouby

This booklet offers a wide-band and expertise self reliant, SPICE-compatible RLC version for through-silicon vias (TSVs) in 3D built-in circuits. This version money owed for a number of results, together with pores and skin impression, depletion capacitance and within sight touch results. Readers will reap the benefits of in-depth insurance of strategies and know-how corresponding to 3D integration, Macro modeling, dimensional research and compact modeling, in addition to closed shape equations for the via silicon through parasitics. ideas coated are tested through the use of TSVs in functions resembling a spiral inductor and inductive-based conversation process and bandpass filtering.

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